Developing Reliable Electronics With New Technology: The Advantages Of Ball Grid Arrays

6 February 2015
 Categories: Industrial & Manufacturing, Blog


For decades, electronic firms like Alltemated Inc, have been developing technology using the miracle of the miniaturized circuit board and its high capacity for performance. While standard techniques involved using a pin grid array for packaging circuits on a board, there have been substantial advancements in technology which make that technique almost antiquated.

Ball grid arrays, or BGAs, have been developed as a method for more densely packaging circuits and creating electronics with a much higher performance rating. Below, you'll find a guide to some of the advantages of using BGA circuit boards in your electronics production, allowing you to remain competitive and profitable well into the coming years.

Minimizing Space

As advances have been made in electronics, one of the primary goals has been to make consumer electronics as small as possible. In order for this to be done without sacrificing performance standards, it requires your manufacturing process to create compact circuitry that can perform complex tasks without overheating or otherwise failing.

BGAs are an important step in this miniaturization process. Because they can be easily layered, they can be more closely compacted onto one small circuit board. You will also find that BGA installation runs much less risk of damaging delicate components with heat, as the balls themselves are comprised of solder, allowing them to be heated without damage.

Easier Packaging

One of the primary difficulties in circuit board construction is accurately placing and packaging components that are incredibly small. Arrays can be easily misaligned, causing the board to become overcrowded or even nonfunctioning. This can cause delays in production that threaten the long term economic viability of your production.

BGAs have the advantage of being easily packaged due to their durability. The ball design of the array creates a greater amount of surface tension when in contact with the board, allowing it to be properly secured without the risk of misalignment. This also means that you'll be able to use the maximum amount of circuit board space.

Heat Tolerance

Handling the heat that is created by the process of using energy is a huge concern of all electronics manufacturers. This means that your circuit design has to have adequate cooling space, which can increase the size of your products and cause inefficiencies. BGAs, however, are incredibly heat tolerant. They cannot be damaged by standard temperatures that are generated by power fluctuations, allowing you to increase the capacity of your products while simultaneously reducing their size.